According to the recent study the interposer market is projected to reach an estimated $1,184 million by 2030 from $379 million in 2023, at a CAGR of 18% from 2023 to 2030. Growth in this market is primarily driven by growing demand for 2.5D and 3D IC packaging and the miniaturization of electronic devices.
Browse 107 figures / charts and 68 tables in this 205 -page report to understand trends, opportunities and forecast in interposer market by product type (2D interposer, 2.5D interposer, and 3D interposer), application (CIS, CPU/GPU, MEMS 3D capping interposer, RF devices, logic SoC, ASIC/FPGA, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World).
Lucintel forecasts that ASIC/FPGA will remain the largest application during the forecast period due to growing demand of artificial intelligence, autonomous car, and machine learning.
2.5D interposer will remain the largest segment due to better speed, power, heterogeneous integration, and simplified integration properties.
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Asia Pacific will remain the largest region over the forecast period due to the presence of large foundries and manufacturing hub for electronic devices. Economic growth, growing urbanization, growing disposable income, and increasing adoption of digital technologies, such as 5G, Internet of things (IoT), and artificial intelligence (AI) driving the demand for semiconductor and advance IC packaging in this region, thereby demand for interposer will also grow.
Murata, Amkor, AGC, Atomica, TSMC are among the major interposer providers.
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Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: [email protected]
Tel. +1-972-636-5056
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